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TC2117
800mA Fixed Low Dropout Positive Regulator
Features
* * * * * * * Fixed Output Voltages: 1.8V, 2.5V, 3.0V, 3.3V Very Low Dropout Voltage Rated 800mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Over-Current and Over-Temperature Protection Space Saving SOT-223 Package
General Description
The TC2117 is a fixed, high accuracy (typically 0.5%) CMOS low dropout regulator. Designed specifically for battery operated systems, the TC2117's CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 80A at full load (20 to 60 times lower than in bipolar regulators). TC2117 key features include ultra low noise, very low dropout voltage (typically 450mV at full load), and fast response to step changes in load. The TC2117 incorporates both over-temperature and over-current protection. The TC2117 is stable with an output capacitor of only 1F and has a maximum output current of 800mA. This device is available in 3-Pin SOT-223, and 3-Pin DDPAK packages.
Applications
* * * * * * 5V to 3.3V Linear Regulator Portable Computers Instrumentation Battery Operated Systems Linear Post-Regulator for SMPS Core Voltage Supply for FPGAs, PLDs, CPUs, DSPs
Typical Application
VIN VIN VOUT C1 1F VOUT
Device Selection Table
Part Number Package Junction Temperature Range -40C to +125C -40C to +125C
TC2117
GND
TC2117-xxVDB 3-Pin SOT-223 TC2117-xxVEB 3-Pin DDPAK
Note: xx indicates output voltages. Available Output Voltages: 1.8, 2.5, 3.0, 3.3. Other output voltages are available. Please contact Microchip Technology Inc. for details.
Package Type
3-Pin SOT-223
Front View
3-Pin DDPAK
Front View Tab is VOUT
3 Tab is VOUT
VIN
TC2117
VOUT 1 GND 2 3 2
TC2117
VOUT GND VIN
2002 Microchip Technology Inc.
1
DS21665B-page 1
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TC2117
1.0 ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V Output Voltage.................... (VSS - 0.3) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 7) Maximum Voltage on Any Pin ......... VIN +0.3V to -0.3V Operating Temperature ............... -40C < TJ < +125C Storage temperature .......................... -65C to +150C
TC2117 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VR + 1.5V (Note 1), IL = 100A, CL = 3.3F, TA = 25C, unless otherwise specified. Boldface type specifications apply for junction temperatures of -40C to +125C. Symbol VIN IOUTMAX VOUT VOUT /T Parameter Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Min 2.7 800 Typ -- -- Max 6.0 -- Units V mA V VR > 2.5V VR = 1.8V (VR + 1V) VIN 6V IL = 0.1mA to IOUTMAX (Note 4) VR > 2.5V, IL = 100 A IL = 100 A IL = 300 A IL = 500 A IL = 800 A VR = 1.8V, IL = 500 A IL = 800 A (Note 5) IL = 0 F < 120Hz VOUT = 0V (Note 6) (Note 2) Test Conditions
VR - 2.5% VR - 0.5% VR + 2.5% VR - 2% VR - 0.5% VR + 3% -- -- -0.01 -- -- -- -- -- -- -- -- -- -- -- -- 40 0.007 0.002 20 60 190 340 600 700 890 80 55 1200 0.04 300 -- 0.35 0 30 160 480 800 1300 1000 1400 130 -- -- -- --
ppm/C (Note 3) % %/mA mV
VOUT /VIN Line Regulation VOUT /VOUT Load Regulation VIN - VOUT Dropout Voltage
IDD PSRR IOUTSC VOUT /PD eN
Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise
A dB mA V/W
nV/Hz IL = 100mA, F = 10kHz
Note 1: VR is the regulator output voltage setting. 2: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1mA to IOUTMAX. 3: TC VOUT = (VOUTMAX - VOUTMIN) x 106 VOUT x T 4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value, measured at a 1.5V differential. 6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the thermal resistance from junction-to-air (i.e., TA, TJ , JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Thermal Considerations section of this data sheet for more details.
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DS21665B-page 2
2002 Microchip Technology Inc.
TC2117
2.0 PIN DESCRIPTIONS
The descriptions for the pins are listed in Table 2-1.
TABLE 2-1:
Pin No. (3-Pin SOT-223) (3-Pin DDPAK) 1 2 3
PIN FUNCTION TABLE
Symbol GND VOUT VIN Connect this pin to the circuit ground. Regulated output voltage. Unregulated Input voltage. Description
2002 Microchip Technology Inc.
DS21665B-page 3
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TC2117
3.0 DETAILED DESCRIPTION
3.2.2 POWER DISSIPATION
The TC2117 is a precision, positive output LDO. Unlike bipolar regulators, the TC2117 supply current does not increase proportionally with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to 800mA operating load range. The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation:
EQUATION 3-1:
PD (VINMAX - VOUTMIN)ILOADMAX Where: PD = Worst case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Maximum regulator output voltage ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 3-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (125C) and the thermal resistance from junction-to-air (JA).
FIGURE 3-1:
TYPICAL APPLICATION CIRCUIT
VIN C1 1F VOUT C2 1F VOUT
TC2117
GND
Battery
3.1
Output Capacitor
EQUATION 3-2:
- TAMAX T PDMAX = JMAX JA Where all terms are previously defined. Table 3-1 shows various values of JA for the TC2117 mounted on a 1/16 inch, 2-layer PCB with 1 oz. copper foil.
A 1F (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance of 0.2 to 10. A 1F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C.) When operating from sources other than batteries, supply noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
TABLE 3-1:
THERMAL RESISTANCE GUIDELINES FOR TC2117 IN 3-PIN SOT-223 PACKAGE
Copper Area (Backside) 2500 sq mm 2500 sq mm 2500 sq mm 2500 sq mm 1000 sq mm 0 sq mm Board Area 2500 sq mm 2500 sq mm 2500 sq mm 2500 sq mm 1000 sq mm 1000 sq mm Thermal Resistance 45C/W 45C/W 53C/W 59C/W 52C/W 55C/W
3.2
3.2.1
Thermal Considerations
THERMAL SHUTDOWN
Copper Area (Topside)* 2500 sq mm 1000 sq mm 225 sq mm 100 sq mm 1000 sq mm 1000 sq mm
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator remains off until the die temperature drops to approximately 150C.
*Tab of device attached to topside copper.
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DS21665B-page 4
2002 Microchip Technology Inc.
TC2117
TABLE 3-2: THERMAL RESISTANCE GUIDELINES FOR TC2117 IN 3-PIN DDPAK PACKAGE
Copper Area (Backside) 2500 sq mm 2500 sq mm 2500 sq mm Board Area 2500 sq mm 2500 sq mm 2500 sq mm Thermal Resistance (JA) 25C/W 27C/W 35C/W
Actual power dissipation: PD (VINMAX - VOUTMIN)ILOADMAX = [(5.0 x 1.05) - (3.3 x .995)] 400 x 10-3 = 786mW Maximum allowable power dissipation: PDMAX = = = (TJMAX - TAMAX) JA (125 - 55) 59 1.186mW
Copper Area (Topside)* 2500 sq mm 1000 sq mm 125 sq mm
*Tab of device attached to topside copper.
Equation 3-1 can be used in conjunction with Equation 3-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 5.0V 5% VOUTMIN = 3.3V 0.5% ILOADMAX = 400mA TJMAX = 125C TAMAX = 55C JA = 59C/W (SOT-223) Find: 1. Actual power dissipation 2. Maximum allowable dissipation
In this example, the TC2117 dissipates a maximum of only 786mW; below the allowable limit of 1.186mW. In a similar manner, Equation 3-1 and Equation 3-2 can be used to calculate maximum current and/or input voltage limits.
2002 Microchip Technology Inc.
DS21665B-page 5
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TC2117
4.0
Note:
TYPICAL CHARACTERISTICS
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Line Regulation vs. Temperature
0.020 0.018 10.0
VIN = 3.5V to 6.0V VOUT = 2.5V IOUT = 0.1mA
Output Noise vs. Frequency
LOAD REGULATION %/mA
CIN = 1F COUT = 1F V IN = 6.0V VOUT = 5V I OUT = 100mA
Load Regulation vs. Temperature
0.0100 0.0090 0.0080 0.0070 0.0060 0.0050 0.0040 0.0030 0.0020 0.0010 0.0100 -40C 0C 25C 70C 85C 125C VOUT = 3V 1mA to 800mA
LINE REGULATION (%)
0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002
NOISE (VHZ)
70C 85C 125C
1.0
0.1
0.000 -40C 0C
25C
0.0 0.01
0.01
1
10
100
1000
TEMPERATURE (C)
FREQUENCY (kHz)
TEMPERATURE ( C)
IDD vs. Temperature
150 135 120 105
Dropout Voltage vs. ILOAD
DROPOUT VOLTAGE (V)
0.600 0.550 0.500 0.450 0.400 0.350 0.300 0.250 0.200 0.150 0.100 0.050 0.000 -40C 85C 70C 25C
VOUT = 3V
3.0V VOUT vs. Temperature
3.030 3.020 3.010 3.000 ILOAD = 0.1mA
VIN = VOUT +1V IOUT = 0.1mA
125C
90 75 60 45 30 15 0 -40C 0C 25C
VOUT (V)
IDD (A)
VOUT = 5V
2.990 2.980 2.970 2.960 2.950 2.940 2.930 2.920 -40C 0C
ILOAD = 300mA ILOAD = 500mA
VOUT = 2.5V
0C
ILOAD = 800mA
70C
85C
125C
0 100 200 300 400 500 600 700 800
25C
70C
85C
125C
TEMPERATURE ( C)
ILOAD (mA)
TEMPERATURE ( C)
Power Supply Rejection Ratio
-10 -20
VINDC = 4V IINAC = 50mVp-p VOUTDC = 3V
Load Step Response
VIN = 4.0V VOUT = 3.0V CIN = 1F Ceramic COUT = 10F Tantalum (0.25 ESR) IOUT = 6mA to 600mA 50mV/DIV
Line Step Response
IOUT = 300mA VIN = 4.0V to 5.0V
COUT = 10F Tantalum (0.25 ESR) CIN = NA
PSRR (dB)
-30 -40 -50 -60 -70
600mA/DIV
IOUT = 60mA COUT = 10F Tantalum
VOUT
50mV/DIV
10
100
1k
10k
100k
1M
FREQUENCY (Hz)
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DS21665B-page 6
2002 Microchip Technology Inc.
TC2117
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
Package marking information not available at this time.
5.2
Taping Information
Component Taping Orientation for 3-Pin SOT-223 Devices
User Direction of Feed
Device Marking
W
PIN 1
P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
3-Pin SOT-223
12 mm
8 mm
4000
13 in
Component Taping Orientation for 3-Pin DDPAK Devices
PIN 1
User Direction of Feed
Device Marking
W P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up)
Carrier Tape, Number of Components Per Reel and Reel Size
Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size
3-Pin DDPAK
24 mm
16 mm
750
13 in
2002 Microchip Technology Inc.
DS21665B-page 7
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TC2117
5.3 Packaging Dimensions
3-Pin SOT-223
.264 (6.70) .248 (6.30)
.122 (3.10) .114 (2.90)
.287 (7.30) .146 (3.70) .264 (6.70) .130 (3.30)
PIN 1 .091 (2.30) TYP. .031 (0.80) .024 (0.60) .071 (1.80) MAX. .004 (0.10) .001 (0.02) .181 (4.60) TYP.
.041 (1.04) .033 (0.84)
10 MAX. .036 (0.91) MIN.
.013 (0.33) .009 (0.24)
Dimensions: inches (mm)
3-Pin DDPAK
.410 (10.41) .385 (9.78) .067 (1.70) .045 (1.14) 3 - 7 (5x) .010 (0.25) .000 (0.00) .051 (1.30) .049 (1.24) .037 (0.94) .026 (0.66) .100 (2.54) TYP. 8 MAX. Dimensions: inches (mm) .026 (0.66) .014 (0.36) .110 (2.79) .068 (1.72) .183 (4.65) .170 (4.32)
.055 (1.40) .045 (1.14)
.370 (9.40) .330 (8.38) .605 (15.37) .549 (13.95)
PIN 1
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DS21665B-page 8
2002 Microchip Technology Inc.
TC2117
NOTES:
2002 Microchip Technology Inc.
DS21665B-page 9
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TC2117
SALES AND SUPPORT
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
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DS21665B-page 10
2002 Microchip Technology Inc.
TC2117
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, PRO MATE, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified.
2002 Microchip Technology Inc.
DS21665B-page 11
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WORLDWIDE SALES AND SERVICE
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03/01/02
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DS21665B-page 12
2002 Microchip Technology Inc.
*B56612SD*
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